Free CheckPoint 156-836 Exam Questions

Become CheckPoint Certified with updated 156-836 exam questions and correct answers

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Total 83 Questions | Updated On: Mar 08, 2026

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Question 1

What is the purpose of interface bonding?

A : A bond interface can be configured for high availability redundancy.

B : A bond interface is used for passing synchronization traffic between the SGMs.

C : For load sharing which increases connection throughput above that which is possible using one physical interface.

D : A bond interface can be configured for high availability redundancy or for load sharing which increases connection throughput above that which is possible using one physical interface.

Answer: D

Question 2

Which distribution mode assigns packets to an SGM based solely on the packet destination IP?

A : User mode

B : Manual mode

C : Network mode

D : Auto-topology mode

Answer: C

Question 3

What is the Correction Layer?

A : Correction Layer is a daemon which corrects errors on Backplane interfaces

B : Correction Layer is a mechanism which handles asymmetric connections in multi-appliance system. For example, in case of NAT

C : Correction Layer is a mechanism which activated in case of asymmetric routing

D : Correction Layer is a Layer of GAIA OS which corrects misspelled commands and allows them to execute

Answer: B

Question 4

The SGM with the lowest member ID (the first one added to the security group.)

A : The MDS that pushes policy to the SMO is considered the SMO Master.

B : The first MHO configured is considered the SMO Master.

C : The SGM with the highest member ID (the last one added to the security group.)

D : What Maestro component is automatically designated the SMO Master?

Answer: D

Question 5

What is the purpose of interface bonding?

A : A bond interface can be configured for high availability redundancy.

B : A bond interface is used for passing synchronization traffic between the SGMs.

C : For load sharing which increases connection throughput above that which is possible using one physical interface.

D : A bond interface can be configured for high availability redundancy or for load sharing which increases connection throughput above that which is possible using one physical interface.

Answer: D

Page: 1 / 17

Total 83 Questions | Updated On: Mar 08, 2026

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